Diamond thermal materials — composites of copper or aluminium with diamond — offer high insulation, low thermal expansion and light weight for thermal management of high-power chips, lasers and RF devices.
Typical properties
| Parameter | Typical value |
|---|---|
| Thermal conductivity (W/m·K) | ≥ 600 |
| Coefficient of thermal expansion (10⁻⁶/K) | 4 – 8 |
| Density (g/cm³) | 3 – 6 |
| Working temperature (°C) | ≤ 350 |
| Shape & size | Discs, blocks and custom shapes per drawing |